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     Description: ceramics cuttingwith uv laser.

    Thickness: 0.3mm

    the r eference is coins.

 

   

Deli laser has wealth of experience in ceramic processing, ceramics cutting ,drilling scriing are our strength point.

The laser processing also includes the laser profiling and laser drilling of silicone rubber, Mylar, Nomex, stainless foils, quartz, mica, zirconia, sapphire, PZT, silicon wafer and other materials used in the microelectronics industry, and other markets requiring high quality precision laser cut parts.

 Deli Laser Solutions owns an experienced team of process development and management, and over 30 sets high end laser machine. Most of our Laser source are imported from the top of the business, such as oxford laser, lumera laser, trumpf laser. Base on that ,we could provide the most comprehensive  Laser processing.



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